Technical Specifications


Model S100

Model D75

Printing Technology

Mask Image Projection
Stereolithography (SLA)
Digital Light Processing (DLP)
Hinged Peel Mechanism
Manual Resin Filling
Easily Removable Supports

Print Volume

5 x 3.2 x 8 in
13 x 8 x 20 cm
3.7 x 2.3 x 8 in
9.6 x 6 x 20 cm

Layer Thickness Options

20 Microns, 50 Microns, 100 Microns

Minimum Feature Size

100 Microns
75 Microns

Print Speed

1 in/hour @ 100 Microns
0.5 in/hour @ 50 Microns
0.15 in/hour @ 20 Microns

Resin Curing Unit

SprintRay Custom-Built HD Projector
Million Pixels Density
Glass + Polycarbonate Lens Construction
Texas Instruments DLP Chip
405nm Blue-Violet Light
LED-based Light Source
50,000 Hours Expected Lifetime

Resin Tank

Machined Aluminum Base Plate
Built-in Drain
Vacuum Formed Cover
Up to 50 Liters Extended Lifetime
One Spare Drum Included

Connectivity

Direct Ad-Hoc Mode via Wi-Fi b/g/n
Local Network via Wi-Fi b/g/n
Local Network via Ethernet Cable

Printer Control

Multi-functional Push Button with LED Status Indicator

Unit Dimensions

15 x 15 x 20 in
38 x 38 x 50 cm

Shipping Size & Weight

22 x 22 x 34 in - 50 lb
56 x 56 x 86 cm - 23 kg
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